Touch panel with single plate and manufacturing method thereof

ABSTRACT

A touch panel with a single plate includes a plate and a sensing circuit structure. The substrate is taken as a cover. The sensing circuit structure is formed on the plate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an input panel and a manufacturingmethod thereof, and more particularly, to a touch panel and amanufacturing method thereof.

2. Description of the Prior Art

Various types of touch input devices have been widely used in electronicproducts. For example, a mobile phone or a tablet PC utilizes a touchpanel as an input device, and a user may easily touch on a surface ofthe input panel with hands to give commands, or slides on the surface ofthe touch panel to operate a cursor or perform handwriting input. Adisplay panel together with the touch panel may also display virtualbuttons for the user to select, and the user may enter correspondingtexts by the virtual buttons.

In general, the touch panels are divided into resistive touch panels,capacitive touch panels, ultrasonic touch panels, infrared touch panels,etc, and the resistive touch panels have the most products. Theresistive touch panels are mainly divided into four-wire, five-wire,six-wire, and eight-wire, etc. Since costs and technical aspects of thefour-wire touch panels are more mature, the four-wire touch panels havebeen widely produced and applied.

The touch panel includes two substrates, a circuit layer, an insulationlayer, and flexible printed circuit board (PCB) patterns. The circuitlayer, the insulation layer, and the flexible PCB patterns are formed onone of the two substrates and are disposed between the two substrates.For common types of the two substrates, one of the two substrates is abase plate and the other is cover lens. However, the touch panel withthe two substrates could have a thicker thickness and is not compliedwith the trend.

Therefore, providing a thinner touch panel and a manufacturing methodthereof has become an important topic.

SUMMARY OF THE INVENTION

It is therefore an objective of the present invention to provide a thintouch panel and a manufacturing method thereof, wherein by a design of asensing circuit structure on a substrate, the single substrate mayprovide a touch function and additional bonding steps are eliminated.Moreover, the substrate is disposed on an operating side of the touchpanel and covers internal circuits to be not exposed to an outside, soas to have a protective effect.

Another objective of the present invention provides a thin touch paneland a manufacturing method thereof, wherein in addition to have thetouch and protective function, since the substrate of the touch panelcover border circuits and other components, a decorative function isfurther provided to avoid the circuits to be exposed and perceived.

For the above objectives, a touch panel with a single plate according tothe present invention comprises a substrate and a sensing circuitstructure. The substrate is taken as a cover, and the sensing circuitstructure is formed on the substrate.

Another touch panel with a single plate according to the presentinvention comprises a substrate and a sensing circuit structure. Thesubstrate is taken as a cover, and the sensing circuit structure isformed on the substrate and has a shielding function.

Another touch panel with a single plate according to the presentinvention comprises a substrate, a sensing circuit structure, and ashielding structure or a shielding body. The substrate is taken as acover, and the sensing circuit structure and the shielding structure orthe shielding body are formed on the substrate.

According to an embodiment of the present invention, the sensing circuitstructure comprises a transparent conductive layer, formed on thesubstrate; a conductive decorative pad, formed on the transparentconductive layer; a decorative layer, formed on the transparentconductive layer and the conductive decorative pad, and having anopening on the conductive decorative pad; and a non-transparentconductive layer, formed on the decorative layer, and electricallyconnected with the transparent conductive layer via the opening.

According to an embodiment of the present invention, the conductivedecorative pad completely covers the opening, a conductive capacity ofthe conductive decorative pad is superior to a conductive capacity ofthe decorative layer, and a color of the conductive decorative pad issimilar to a color of the decorative layer.

According to an embodiment of the present invention, a part of thenon-transparent conductive layer is formed on the opening; according toanother embodiment of the present invention, the sensing circuitstructure further comprises a conductive filler, formed on the opening;or according another embodiment of the present invention, a part of thenon-transparent conductive layer and the conductive filler are formed onthe opening.

According to an embodiment of the present invention, the sensing circuitstructure comprises a transparent conductive layer, formed on thesubstrate; a shielding decorative layer, formed on the substrate and thetransparent conductive layer; a transparent conductive connection layer,formed on the transparent conductive layer and the shielding decorativelayer, extended from the transparent conductive layer toward theshielding decorative layer, and exceeding an edge of the transparentconductive layer; and a non-transparent conductive layer, formed on theshielding decorative layer and the transparent conductive connectionlayer, and not formed on the transparent conductive layer.

According to an embodiment of the present invention, the non-transparentconductive layer formed on the shielding decorative layer is extendedtoward the transparent conductive layer and doest not exceed the edge ofthe transparent conductive layer.

According to an embodiment of the present invention, a material of theshielding decorative layer comprises various color inks with insulation,a material of the transparent conductive layer comprises conductivepolymer resin or indium tin oxide, and a material of the non-transparentconductive layer comprises silver glue, copper, molybdenum, or aluminum.

According to an embodiment of the present invention, a color of theshielding decorative layer is arbitrary but not corresponding to a colorof the transparent conductive layer.

According to an embodiment of the present invention, the shieldingdecorative layer has an opening on the transparent conductive layer, thetransparent conductive connection layer is filled into the opening, andthe sensing circuit structure further comprise another shieldingdecorative layer, formed on the transparent conductive layer to coverthe opening.

According to an embodiment of the present invention, the touch panel isa rigid or flexible touch panel.

According to an embodiment of the sensing circuit structure comprisingthe non-transparent conductive layer, a material of the non-transparentconductive layer comprises radiation-curable conductive material, andthe non-transparent conductive layer is formed by utilizing a radiationto irradiate the radiation-curable conductive material for curing a partof the radiation-curable conductive material and removing an incurableradiation-curable conductive material, wherein a curable part of theradiation-curable conductive material is made by setting a mask on theradiation-curable conductive material to selectively cure theradiation-curable conductive material. Additionally, a material of thenon-transparent conductive layer comprises nano silver or micron silver,and a material of the non-transparent conductive layer further comprisestitanium, zinc, zirconium, antimony, indium, tin, copper, molybdenum oraluminum. Moreover, the non-transparent conductive layer is formed byrelief printing, gravure printing, offset printing, or screen printing.

According to an embodiment of the present invention, the transparentconductive layer comprises a plurality of first transparent conductiveunits and a plurality of second transparent conductive units, theplurality of first transparent conductive units and the plurality ofsecond transparent conductive units are formed on a same side of thesubstrate, and the plurality of first transparent conductive units andthe plurality of second transparent conductive units respectively havean extending direction perpendicular to each other. Additionally, thetransparent conductive layer further comprises an insulation part formedbetween the plurality of first transparent conductive units and theplurality of second transparent conductive units.

According to an embodiment of the present invention, the sensing circuitstructure further comprises a pin; and a conductive bonding object,wherein the conductive bonding object bonds the pin and thenon-transparent conductive layer, or the conductive bonding object isformed on the substrate, bonds the pin and the substrate, andelectrically connects the pin and the transparent conductive layer.

For the above objectives, a manufacturing method of a touch panel with asingle plate according to the present invention comprises forming asensing circuit structure having a shielding function on a substrate;and taking the substrate as a cover.

Another manufacturing method of a touch panel with a single plateaccording to the present invention comprises forming a sensing circuitstructure having a shielding function on a substrate; and taking thesubstrate as a cover.

Another manufacturing method of a touch panel with a single plateaccording to the present invention comprises forming a sensing circuitstructure and a shielding structure or a shielding body on a substrate;and taking the substrate as a cover.

According to an embodiment of the present invention, the step of formingthe sensing circuit structure comprises forming a transparent conductivelayer on the substrate; forming a conductive decorative pad on thetransparent conductive layer; forming a decorative layer on theconductive decorative pad, wherein the decorative layer has an openingon the conductive decorative pad; and forming a non-transparentconductive layer on the decorative layer, wherein the non-transparentconductive layer is electrically connected with the transparentconductive layer via the opening.

According to an embodiment of the present invention, the step of formingthe sensing circuit structure comprises forming a transparent conductivelayer on the substrate; forming a shielding decorative layer on thesubstrate and the transparent conductive layer; forming a transparentconductive connection layer on the transparent conductive layer and theshielding decorative layer, wherein the transparent conductiveconnection layer is extended from the transparent conductive layertoward the shielding decorative layer and exceeds an edge of thetransparent conductive layer; and forming a non-transparent conductivelayer on the shielding decorative layer and the transparent conductiveconnection layer, wherein the non-transparent conductive layer is notformed on the transparent conductive layer.

According to an embodiment of the present invention, the shieldingdecorative layer has an opening on the transparent conductive layer, thetransparent conductive connection layer is filled into the opening, andthe step of forming the sensing circuit structure further comprisesforming another shielding decorative layer on the transparent conductivelayer to cover the opening.

According to an embodiment of the present invention, a touch panel witha single plate may be combined with a display panel, a side of a sensingcircuit structure is formed on the touch panel, another side of thesensing circuit structure is combined with the display panel, and thesensing circuit structure is formed between the touch panel and thedisplay panel.

According to an embodiment of the sensing circuit structure comprisingthe non-transparent conductive layer, the non-transparent conductivelayer is formed by utilizing a radiation to irradiate theradiation-curable conductive material for curing a part of theradiation-curable conductive material and removing an incurableradiation-curable conductive material, wherein a curable part of theradiation-curable conductive material is made by setting a mask on theradiation-curable conductive material to selectively cure theradiation-curable conductive material. Moreover, the non-transparentconductive layer is formed by relief printing, gravure printing, offsetprinting, or screen printing.

According to the above embodiment, the transparent conductive layercomprises a plurality of first transparent conductive units and aplurality of second transparent conductive units, the plurality of firsttransparent conductive units and the plurality of second transparentconductive units are formed on a same side of the substrate, and theplurality of first transparent conductive units and the plurality ofsecond transparent conductive units respectively have an extendingdirection perpendicular to each other, wherein the transparentconductive layer further comprises an insulation part formed between theplurality of first transparent conductive units and the plurality ofsecond transparent conductive units.

According to an embodiment of the present invention, the step of formingthe sensing circuit structure further comprises forming a conductivebonding object on the substrate; and bonding the pin and the substrateby the conductive bonding object, and electrically connecting the pinand the transparent conductive layer by the conductive bonding object.

In summary, according to the touch panel with the single plate and themanufacturing method thereof of the present invention, the substrate isutilized for forming the sensing circuit structure to provide atraditional touch function. Moreover, a disposing location of the singleplate in the touch panel is located on the operating side and may bedirectly taken as the cover, such that the circuits and componentscovered by the single plate may not be exposed to the outside to havethe protective effect. Additionally, in the embodiment, the sensingcircuit structure formed on the substrate may also have the shieldingfunction, or the shielding structure or the shielding body may also beformed on the other substrate. Therefore, when the substrate covers theborder circuits and other components, which are not desired to beperceived by the user, the substrate may have the shielding effect andfacilitate a planarization of the touch panel.

The touch panel with the single plate and the multi-function of thepresent invention may be implemented by improving the structure of thesubstrate. In comparison to the prior art, the single plate provides thecompletely touch function, does not require bonding the cover film orcover lens by the bonding process, and may maintain a structuralstrength supported by the general touch panel. Thus, in addition toeliminating a requirement of utilizing another substrate to form thetouch panel, the space and manufacturing cost of bonding the cover filmor the cover lens is further saved to be conductive to thin the product,which belongs to a creative concept of forward-looking.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A-FIG. 1C illustrate schematic diagrams of a touch panel accordingto a preferred embodiment of the present invention.

FIG. 2A-FIG. 2B illustrate schematic diagrams of a touch panel accordingto a preferred embodiments of the present invention.

FIG. 3A-FIG. 3C illustrate schematic diagrams of a touch panel accordingto a preferred embodiments of the present invention.

FIG. 4A-FIG. 4C illustrate schematic diagrams of a touch panel accordingto a preferred embodiments of the present invention.

FIG. 5A-FIG. 5B illustrate schematic diagrams of a touch panel accordingto a preferred embodiments of the present invention.

FIG. 6A illustrates a top view diagram of a touch panel according to apreferred embodiment of the present invention.

FIG. 6B illustrates a side-view diagram of a section line A-A in FIG.6A.

FIG. 6C illustrates a sectional diagram of a touch panel according to apreferred embodiment of the present invention.

FIG. 7A-FIG. 7B illustrate schematic diagrams of touch panels accordingto another preferred embodiments of the present invention.

DETAILED DESCRIPTION

According to related figures, a touch panel with a single plate and amanufacturing method thereof according to a preferred embodiment of thepresent invention are described below, wherein the same components willbe illustrated as the same reference numbers.

The touch panel of the present invention has the single substrate andalso has at least touch and protective functions, preferably has all ofthe touch, protective and decorative functions, and belongs to acreative concept of forward-looking. In addition to thinning the touchpanel, since additional steps for bonding or assembling may besimplified, the touch panel of the present invention is suitable for amodular manufacturing process. Based on the above concept, the presentinvention may have different embodiments, and below two main structuresare represented for illustration, and are not limited herein. In otherwords, any structure complied with the above creative concept is alsocovered in the scope of the present invention.

FIG. 1A-FIG. 1C illustrate schematic diagrams of a touch panel 1according to a preferred embodiment of the present invention. As shownin FIG. 1A, the touch panel 1 includes a substrate 10 and a sensingcircuit structure S. The substrate 10 is taken as a cover and thesensing circuit structure S is formed on the substrate 10. The sensingcircuit structure S includes a transparent conductive layer 11, aconductive decorative pad 12 and a decorative layer 13. The transparentconductive layer 11 is formed on the substrate 10. The conductivedecorative pad 12 is formed on the transparent conductive layer 11. Thedecorative layer 13 is formed on the transparent conductive layer 11 andthe conductive decorative pad 12, and has an opening 131 on theconductive decorative pad 12. The substrate 10 may be a substrate or afilm, and a material of the substrate 10 may include a glass. Forexample, the substrate 10 may be a glass substrate. When the substrate10 is the film, the touch panel 1 may be a flexible touch panel.

For example, since the sensing circuit structure S is formed on thesubstrate 10, the touch function may be provided. Besides, since thetouch panel 1 is operated on an outer surface of the substrate 10, thesubstrate 10 may cover the sensing circuit structure S and othercomponents, such that the sensing circuit structure S and the othercomponents are not exposed to the outside or directly contacted with theoutside. Meanwhile, since the substrate 10 also has a certain degree ofstructural strength, the substrate 10 may be directly taken as the coverto provide the protective function.

The sensing circuit structure S may be sequentially formed on thesubstrate 10 according to the following steps:

Form the transparent conductive layer 11 on the substrate 10;

Form the conductive decorative pad 12 on the transparent conductivelayer 11; and

Form the decorative layer 13 on the conductive decorative pad 12,wherein the decorative layer 13 has the opening 131 on the conductivedecorative pad 12.

The transparent conductive layer 11 defines touch sensing circuits by apattern etching process. The transparent conductive layer 11 has amaterial such as indium tin oxide (ITO), and the decorative layer 13 hasa material such as an insulation material. The transparent conductivelayer 11 defines a plurality of wires as the touch sensing circuits on atouch input region of the touch panel 1, and the transparent conductivelayer 11 in the touch input region is not covered by the decorativelayer 13.

The outer surface 101 of the substrate 10 is provided for a user tooperate. The user usually watches the touch panel 1 through the outersurface 101 and performs an operation on the outer surface 101. Theremaining layers and components of the touch panel 1 are formed on theinner surface 102 of the substrate 10.

As shown in FIG. 1B, the sensing circuit structure S includes anon-transparent conductive layer 14. The non-transparent conductivelayer 14 is formed on the decorative layer 13, and is electricallyconnected with the transparent conductive layer 11 via the opening 131.A material of the non-transparent conductive layer 14 may be silverglue. The non-transparent conductive layer 14 may define fine circuitsvia a screen printing equipment with a screen printing plate of the finecircuits to print on the decorative layer 13. A part 141 of thenon-transparent conductive layer 14 is filled into the opening 131 andis connected with the transparent conductive layer 11 via the opening131. Of course, in addition to the screen printing for defining the finecircuits on the non-transparent conductive layer 14, methods of reliefprinting, gravure printing or offset printing may also be applied to thepresent invention, and is not limited herein. The silver glue of thetransparent conductive layer 14 includes nano silver or micron silver,and preferably includes conductive metals of titanium, zinc, zirconium,antimony, indium, tin, copper, molybdenum or aluminum, etc.

For example, after each layer in FIG. 1A is formed, the non-transparentconductive layer 14 is formed on the decorative layer 13. The conductivedecorative pad 12 completely covers the opening 131, and since aconductive capacity of the conductive decorative pad 12 is superior to aconductive capacity of the decorative layer 13, the non-transparentconductive layer 14 is conducted with the transparent conductive layer11 via the conductive decorative pad 12 instead of the decorative layer13.

The non-transparent conductive layer 14 is described in detail. First,in addition to utilizing the printing technology, the non-transparentconductive layer 14 may be formed with a lithography process.Specifically, the material of the non-transparent conductive layer 14includes a radiation-curable conductive material. The non-transparentconductive layer 14 is formed by utilizing a radiation to irradiate theradiation-curable conductive material for curing a part of theradiation-curable conductive material. Then, the non-transparentconductive layer is formed after an incurable radiation-curableconductive material is removed by a method, such as pure water cleaningor etching, etc. As a result, in addition to maintaining the quick andeasy advantages of the printing process, the patterns of the finecircuits are formed with smaller line widths and narrower line spacing.Additionally, for a better effect of the overall process, a curable partof the radiation-curable conductive material may be cured by setting amask on the radiation-curable conductive material to selectively curethe radiation-curable conductive material. According to an embodiment,the radiation may be ultraviolet.

Furthermore, the above radiation-curable conductive material includes aradiation-curable conductive material of a photosensitive type and isnot limited to a special composition, and may be any one material, whichhas certain conductivity and has drying or curing properties as thematerial is exposed to light especially to a short wavelength radiation.

A shape and a color of the conductive decorative pad 12 are arbitrary,and the color of the conductive decorative pad 12 is not limited to aparticular color. For a preferred effect, the color of the conductivedecorative pad 12 is similar to the color of the decorative layer 13.Thus, when the user looks the touch panel 1 through the outer surface101, the user is not easy to perceive a difference between theconductive decorative pad 12 and the decorative layer 13. The part 141of the non-transparent conductive layer 14 is formed on the opening 131.In a preferred condition, the opening 131 should be completely filledwith the material of the non-transparent conductive layer 14. Even ifthe opening 131 is not completely filled with the material of thenon-transparent conductive layer 14 and a part of the opening 131 is notfilled with anything, the user still may not perceive the generatedcolor difference. Since the opening 131 is covered by the conductivedecorative pad 12, when the user watches the touch panel 1 through theouter surface 101, the user may not perceive the color difference due tothe unfilled opening 131, so as to compensate an alignment error of themanufacturing process.

For example, the conductive decorative pad 12 has a material such ascarbon, nano copper, nano silver, or a conductive polymer resin, etc.,the decorative layer 13 has a material such as various color inks withinsulation, and both are not limited herein. Besides, thenon-transparent conductive layer 14 does not exceed the decorative layer13, and the material of the non-transparent conductive layer 14 may bemetal.

As shown in FIG. 1C, the sensing circuit structure S further includes aninsulation layer 15, a conductive bonding object 16, and a pin 17. Theinsulation layer 15 is formed on the non-transparent conductive layer14, and the conductive bonding object 16 bonds the pin 17 and thenon-transparent conductive layer 14.

For example, the insulation layer 15 is covered on the non-transparentconductive layer 14 by screen printing, so as to protect thenon-transparent conductive layer 14 from oxidizing due to exposure tothe air. The pin 17 may be a pin of a flexible printed circuit board(FPC) and is bonded and fixed on the non-transparent conductive layer 14next to the insulation layer 15 by the conductive bonding object 16. Thepin 17 is electrically connected with the transparent conductive layer11 through the conductive bonding object 16 and the non-transparentconductive layer 14. The conductive bonding object 16 may be anisotropicconductive film (ACF) or anisotropic conductive paste (ACP).

FIG. 2A-FIG. 2B illustrate schematic diagrams of a touch panel 1 aaccording to a preferred embodiments of the present invention. As shownin FIG. 2A, the transparent conductive layer 11 is formed on thesubstrate 10. The conductive decorative pad 12 is formed on thetransparent conductive layer 11. The decorative layer 13 is formed onthe transparent conductive layer 11 and the conductive decorative pad12, and the decorative layer 13 has an opening 131 on the conductivedecorative pad 12. A conductive filler 18 is formed in the opening 131.The structure and manufacturing process of the transparent conductivelayer 11, the conductive decorative pad 12, and the decorative layer 13are similar to FIG. 1A.

As shown in FIG. 2B, the non-transparent conductive layer 14 is formedon the decorative layer 13 and the conductive filler 18. That is, theconductive filler 18 is first filled into the opening 131, and then thenon-transparent conductive layer 14 is formed on the decorative layer 13and the conductive filler 18. Next, similar to FIG. 1C, the insulationlayer 15 is formed on the non-transparent conductive layer 14, and theconductive bonding object 16 bonds the pin 17 and the non-transparentconductive layer 14.

FIG. 3A-FIG. 3B illustrate schematic diagrams of a touch panel 1 baccording to a preferred embodiments of the present invention. As shownin FIG. 3A, the transparent conductive layer 11 is formed on thesubstrate 10. The conductive decorative pad 12 is formed on thetransparent conductive layer 11. The decorative layer 13 is formed onthe transparent conductive layer 11 and the conductive decorative pad12, and the decorative layer 13 has the opening 131 on the conductivedecorative pad 12. The conductive filler 18 is formed on the opening 131and is not completely filled into the opening 131. The structure andmanufacturing process of each layer are similar to FIG. 1A.

As shown in FIG. 3B, the non-transparent conductive layer 14 is formedon the decorative layer 13 and the conductive filler 18, and a part 141a of the non-transparent conductive layer 14 is filled into a space ofthe opening 131, which is not filled with the conductive filler 18. Thatis, the conductive filler 18 is first filled into the opening 131, andthen the non-transparent conductive layer 14 is formed on the decorativelayer 13 and the conductive filler 18. At the same time, thenon-transparent conductive layer 14 is also filled into the unfilledspace of the opening 131. Next, similar to FIG. 1C, the insulation layer15 is formed on the non-transparent conductive layer 14, and theconductive bonding object 16 bonds the pin 17 and the non-transparentconductive layer 14.

Howsoever, since the conductive decorative pad 12 is formed on thesubstrate 10, when the user looks the touch panel 1 b through the outersurface 101, the opening 131, the non-transparent conductive layer 14,or the conductive filler 18 may not be perceived by the user and thealignment error of the process may also be compensated.

In the above embodiment, when the substrate is the film, the touch panelmay be a touch panel with a flexible characteristic, or namely aflexible touch panel. When the substrate is the glass, the touch panelmay be a touch panel with a rigid characteristic or namely a rigid touchpanel. Of course, when the substrate is a soft glass, the touch panelstill has the flexible characteristic.

In the above embodiments, the touch panels 1, 1 a, and 1 b may merelyhave only one substrate, and the substrate 10 has three functions forfirst, forming the sensing circuit structure S; second, directly servingas the cover; third, shielding the internal circuits and components.Therefore, since the touch panels 1, 1 a, 1 b do not require configuringanother substrate, the overall thickness of each panel is thinner andthe overall light transmittance thereof may be superior due to thethinner thickness of the panel. Additionally, since only one substrateis utilized, bonding the two substrates is not required. The problem ofyield loss caused by the bonding process is not appeared, so theproduction yield may be improved. Moreover, since the required processand auxiliary material, such as transparent plastic, film or glasscover, for bonding may be decreased, the manufacturing cost may bereduced. Besides, in the manufacturing cost, since one substrate and anoptical layer are not utilized, the cost may be lower. In the aboveembodiment, the opening is utilized for directly or indirectlyelectrically connecting the non-transparent conductive layer and thetransparent conductive layer. Since the opening of the decorative layeris located on the conductive decorative pad above the transparentconductive layer, the conductive decorative pad and the decorative layermay cover the border circuits to avoid visual exposedness to outside,such that the border circuits are not perceived by the user. Inaddition, the touch panel and related manufacturing method of thepresent invention only utilize the single plate and facilitate thethinning of the product.

FIG. 3C illustrates a schematic diagram of a touch panel 1 c accordingto another preferred embodiments of the present invention. The touchpanel 1 c is substantially similar to the above touch panels 1, 1 a, 1b, except that the touch panel 1 c further includes a shieldingstructure 19. The shielding structure 19 is formed on the substrate 10,and in the embodiment, the shielding structure 19 is formed on thesubstrate 10 by forming on the sensing circuit structure S. Theshielding structure 19 may be a decorative layer, and is made byprinting with various color inks of insulation and may have theshielding effect. Since the shielding structure 19 is configured, thedecorative layer is not required in the surrounding conductive structureC (such as the decorative layer 13 in FIG. 3B), and the processing stepand cost may be saved. Preferably, the touch panel may have theshielding structure and simultaneously form the decorative layer on thesensing circuit structure to enhance the shielding effect.

Additionally, in other embodiments, the touch panel may also have ashielding body to replace the shielding structure. Besides, thedifference between the shielding body and the shielding structure isthat the shielding body is more three-dimensional. For example, athickness of the shielding body is greater than that of the shieldingstructure, or the shielding body is formed by a specific structure.

FIG. 4A-FIG. 4C illustrate schematic diagrams of a touch panel 2according to a preferred embodiment of the present invention. As shownin FIG. 4A, the touch panel 2 includes a substrate 20 and a sensingcircuit structure S4. The substrate 20 is taken as a cover, and thesensing circuit structure S4 is formed on the substrate 20. The sensingcircuit structure S4 includes a transparent conductive layer 21, ashielding decorative layer 22, and a transparent conductive connectionlayer 23. The transparent conductive layer 21 is formed on the substrate20, and the shielding decorative layer 22 is formed on the substrate 20and the transparent conductive layer 21.

For example, the sensing circuit structure S4 is formed on the substrate20, and the substrate 20 is directly taken as the cover.

The sensing circuit structure S4 may be sequentially formed on thesubstrate 20 according to the following steps:

Form the transparent conductive layer 21 on the substrate 20;

Form the shielding decorative layer 22 on the substrate 20 and thetransparent conductive layer 21; and

Form the transparent conductive connection layer 23 on the transparentconductive layer 21 and the shielding decorative layer 22, wherein thetransparent conductive connection layer 23 is extended from thetransparent conductive layer 21 toward the shielding decorative layer22, exceeds an edge of the transparent conductive layer 21, and may beformed by utilizing a printing method.

The transparent conductive layer 21 defines touch sensing circuits by apattern etching process. The transparent conductive layer 21 has amaterial such as indium tin oxide (ITO), and the shielding decorativelayer 22 has a material such as an insulation material or various colorinks with insulation. The transparent conductive connection layer 23 hasa material such as a conductive polymer material or indium tin oxide,and the conductive polymer material is as a conductive ink. Thetransparent conductive connection layer 23 may be formed on thetransparent conductive layer 21 and the shielding decorative layer 22 byutilizing the printing method. The transparent conductive layer 21defines a plurality of wires as the touch sensing circuits on a touchinput region of the touch panel 2, and the transparent conductive layer21 in the touch input region is not covered by the shielding decorativelayer 22.

An outer surface 201 of the substrate 20 is provided for the user tooperate. The user usually watches the touch panel 2 through the outersurface 201 and performs an operation on the outer surface 201. Theremaining layers and components of the touch panel 2 are formed on aninner surface 202 of the substrate 20.

As shown in FIG. 4B, the touch panel 2 includes a non-transparentconductive layer 24. The non-transparent conductive layer 24 is formedon the shielding decorative layer 22 and the transparent conductiveconnection layer 23, and is not formed on the transparent conductivelayer 21. A material of the non-transparent conductive layer 24 may besilver glue. The non-transparent conductive layer 24 may defines finecircuits via a screen printing equipment with a screen printing plate ofthe fine circuits to print on the shielding decorative layer 22.Additionally, the material of the non-transparent conductive layer 24may also include metal, such as copper, molybdenum, or aluminum, etc,and the copper wires, the aluminum or molybdenum wires are formed by asputtering process. The non-transparent conductive layer 24 formed onthe shielding decorative layer 22 is extended toward the transparentconductive layer 21 and does not exceed an edge of the transparentconductive layer 21.

For example, after each layer in FIG. 4A is formed, the non-transparentconductive layer 24 is formed on the shielding decorative layer 22 andthe transparent conductive connection layer 23, and the non-transparentconductive layer 24 is not formed on the transparent conductive layer21. Thus, the non-transparent conductive layer 24 may be conducted withthe transparent conductive layer 21 via the transparent conductiveconnection layer 23.

As shown in FIG. 4C, the touch panel 2 further includes an insulationlayer 25, a conductive bonding object 26, and a pin 27. The insulationlayer 25 is formed on the non-transparent conductive layer 24, and theconductive bonding object 26 bonds the pin 27 and the non-transparentconductive layer 24.

For example, the insulation layer 25 is covered on the non-transparentconductive layer 24 by screen printing, so as to protect thenon-transparent conductive layer 24 from oxidizing due to exposure tothe air. The pin 27 may be a pin of a flexible printed circuit board(FPC) and is bonded and fixed on the non-transparent conductive layer 24next to the insulation layer 25 by the conductive bonding object 26. Thepin 17 is electrically connected with the transparent conductive layer21 through the conductive bonding object 26 and the non-transparentconductive layer 24. The conductive bonding object 16 may be anisotropicconductive film (ACF) or anisotropic conductive paste (ACP).

FIG. 5A-FIG. 5B illustrate schematic diagrams of a touch panel 2 aaccording to a preferred embodiments of the present invention. As shownin FIG. 5A, the transparent conductive layer 21 is formed on thesubstrate 20 and the shielding decorative layer 22 is formed on thesubstrate 20 and the transparent conductive layer 21. The shieldingdecorative layer 22 has an opening, a first part 221, and a second part222. The opening is located on the transparent conductive layer 21 andbetween the first part 221 and the second part 222. The transparentconductive connection layer 23 is filled into the opening and contactedwith the transparent conductive layer 21. The structure andmanufacturing process of the transparent conductive layer 21, theshielding decorative layer 22, and the transparent conductive connectionlayer 23 are similar to FIG. 5A. Another shielding decorative layer 22′is formed above the opening of the shielding decorative layer 22. Theshielding decorative layer 22′ is at least formed on the transparentconductive connection layer 23 to cover the opening of the shieldingdecorative layer 22, so as to prevent light piercing from a side of thetouch panel 2 to another side of the touch panel 2 through the opening.

In the embodiment, the shielding decorative layer 22′ is formed on theshielding decorative layer 22 and the transparent conductive connectionlayer 23. A side of the shielding decorative layer 22′ is extendedtoward the first part 221 and exceeds an edge of the transparentconductive layer 21 but does not exceed an edge of the transparentconductive connection layer 23, so as to limit the forming location ofthe following non-transparent conductive layer 24. Another side of theshielding decorative layer 22′ is extended toward the second part 222and doest not exceed an edge of the shielding decorative layer 22.

Colors of the decorative layers 22 and 22′ may be the same or similar toavoid the user seeing the opening of the shielding decorative layer 22or perceiving a color difference between the transparent conductiveconnection layer 23 and the shielding decorative layer 22. Additionally,the decorative layers 22 and 22′ may also have the different colors,and/or different brightness. The opening of the shielding decorativelayer 22 may be designed into a specific pattern, such as texts or marksrelated to the product, or texts or marks related to the manufacturer,etc. The texts or marks are displayed by the shielding decorative layer22′, and if a contrast between the decorative layers 22 and 22′ is moreobvious, the texts or marks are more obvious.

As shown in FIG. 5B, the non-transparent conductive layer 24 is formedon the shielding decorative layer 22 and the transparent conductiveconnection layer 23. That is, the transparent conductive connectionlayer 23 is first filled into the opening between the first part 221 andsecond part 222, and then the non-transparent conductive layer 24 isformed on the shielding decorative layer 22 and the transparentconductive connection layer 23. The structure and manufacturing processof the non-transparent conductive layer 24 are similar to FIG. 5B. Inthe embodiment, the non-transparent conductive layer 24 is formed nextto the shielding decorative layer 22. Even if the non-transparentconductive layer 24 is not accurately formed next to the shieldingdecorative layer 22 due to a processing error, for example, a part ofthe non-transparent conductive layer 24 is formed on the shieldingdecorative layer 22′ or a gap is formed between the non-transparentconductive layer 24 and the shielding decorative layer 22′, thesedrawbacks may be covered by the decorative layers 22 and 22′ and may notbe perceived by the user.

Additionally, a sequence for forming the shielding decorative layer 22′and the non-transparent conductive layer 24 may be interchangeable. Asshown in FIG. 5A, the transparent conductive layer 21 is formed on thesubstrate 20 and the shielding decorative layer 22 is formed on thesubstrate 20 and the transparent conductive layer 21. The shieldingdecorative layer 22 has an opening, the first part 221, and the secondpart 222. The opening is located on the transparent conductive layer 21and between the first part 221 and the second part 222. The transparentconductive connection layer 23 is filled into the opening and contactedwith the transparent conductive layer 21. At this moment, the shieldingdecorative layer 22′ is not formed first. As shown in FIG. 5B, thenon-transparent conductive layer 24 is first formed on the shieldingdecorative layer 22 and the transparent conductive connection layer 23,and then the shielding decorative layer 22′ is formed on the opening ofthe shielding decorative layer 22. The shielding decorative layer 22′ isat least formed on the transparent conductive connection layer 23 tocover the opening of the shielding decorative layer 22. In theembodiment, the shielding decorative layer 22′ is formed next to thenon-transparent conductive layer 24.

Next, similar to FIG. 4C, the insulation layer 25 is formed on thenon-transparent conductive layer 24, and the conductive bonding object26 bonds the pin 27 and the non-transparent conductive layer 24.

Howsoever, since the non-transparent conductive layer 24 is formed onthe shielding decorative layer 22 and does not exceed the edge of thetransparent conductive layer 21, and other external non-transparentcomponents for connecting also do not reach the edge of the transparentconductive layer 21, the non-transparent conductive layer 24 and theother external non-transparent components for connecting are not locatedabove the transparent conductive layer 21. Thus, when the user watchesthe touch panel 2, 2 a through the outer surface 201, the user may notperceive the non-transparent components in the region of the transparentconductive layer 21. Since the transparent conductive connection layer23 is transparent, the color of the decorative layer is not requiredcorresponding to the color of the transparent conductive connectionlayer 23, and may be arbitrary, which does not affect the user to watchas well. Moreover, the shielding decorative layer 22 may cover theborder circuits, for example, to cover the circuits formed on thenon-transparent conductive layer 24. Thus, when the user looks towardthe border circuits, the user may look the shielding decorative layer 22instead of the border circuits, and may not perceive the colordifference between the border circuits and the other components, suchthat the touch panel with no color difference of the border circuit isachieved.

In the above embodiment, when the substrate is the film, the touch panelmay be a touch panel with a flexible characteristic, or namely aflexible touch panel. When the substrate is the glass, the touch panelmay be a touch panel with a rigid characteristic or namely a rigid touchpanel. Of course, when the substrate is a soft glass, the touch panelstill has the flexible characteristic.

In the above embodiment, the touch panels 2 and 2 a merely have only onesubstrate, and the substrate 20 has three functions for first, formingthe sensing circuit structure S4; second, directly serving as the cover;third, shielding the border circuits. Therefore, since the touch panels2, 2 a do not require configuring another substrate, the overallthickness of the panel is smaller and the overall light transmittancemay be superior due to the smaller thickness of the panel. Additionally,since only one substrate is utilized, bonding the two substrates is notrequired. The problem of yield loss caused by the bonding process is notappeared, so the production yield may be improved. Moreover, since therequired process and auxiliary material, such as transparent plastic,film or glass cover, for bonding may be decreased, the manufacturingcost may be reduced. Besides, in the manufacturing cost, since onesubstrate and an optical layer are not utilized, the cost may be lower.

The transparent conductive connection layer is extended from thetransparent conductive layer toward the shielding decorative layer andexceeds the edge of the transparent conductive layer. Thenon-transparent conductive layer is formed on the transparent conductiveconnection layer and is not formed above the transparent conductivelayer. Therefore, the shielding decorative layer may cover thenon-transparent conductive layer 24 served for the border circuits toavoid visual exposedness, such that the user may not perceive the bordercircuits. In addition, the touch panel and related manufacturing methodof the present invention only utilize the single plate and facilitatethe thinning of the product.

The description of the three functions for the single plate may bereferred to the aforementioned embodiment, and is not narratedhereinafter. Emphatically, the covering function of the three functionsmay be achieved by the decorative layer, the shielding structure, theshielding body, or any combination thereof in the sensing circuitstructure.

In the above embodiment, the produced touch panel with the single platemay be combined with a display panel, that is, a side of the sensingcircuit structure is formed on the touch panel and another side of thesensing circuit structure is combined with the display panel. Thesensing circuit structure is formed between the touch panel and thedisplay panel. For example, the sensing circuit structure may be coatedwith an optical adhesive layer, and the optical adhesive layer isutilized for combining the touch panel and the display panel. Note that,the optical adhesive is not utilized for combining the touch panel withanother substrate, because the touch panel only has a single substrate.

Additionally, according to a creation of the single substrate in thepresent invention, the transparent conductive layer may have differentdetailed structures. First, please refer to FIGS. 6A and 6B. FIG. 6Aillustrates a top view diagram of a touch panel according to a preferredembodiment of the present invention. FIG. 6B illustrates a side-viewdiagram of a section line A-A in FIG. 6A. The touch panel 6 a issubstantially similar to the above touch panel, except that atransparent conductive layer 61 of a sensing circuit structure S6includes a plurality of first transparent conductive units 611 and aplurality of second transparent conductive units 612. The firsttransparent conductive unit 611 and the second transparent conductiveunit 612 are formed on a same side of the substrate 60 (such as an innersurface 602), and the first transparent conductive unit 611 and thesecond transparent conductive unit 612 respectively have an extendingdirection perpendicular to each other (such as X-axis and Y-axisdirections in FIG. 6A). Besides, the first transparent conductive unit611 is connected by the bridging part 613. Please refer to FIG. 6B, aninsulation part 614 is formed between the bridging part 613 and thesecond transparent conductive unit 612 in order to avoid mutualinterference.

FIG. 6C illustrates a sectional diagram of a touch panel according to apreferred embodiment of the present invention. The structure in FIG. 6Cis substantially similar to the structure in FIG. 6B, except that thoughthe first transparent conductive unit 611 and the second transparentconductive unit 612 are formed on the same side of the substrate 60, awhole layer of the insulation part 614 is formed between the firsttransparent conductive unit 611 and the second transparent conductiveunit 612. The insulation part 614 may also have the insulation effectbetween the first transparent conductive unit 611 and the secondtransparent conductive unit 612 to avoid the interference.

FIG. 7A-FIG. 7B illustrate schematic diagrams of touch panels accordingto another preferred embodiments of the present invention. Please referto FIG. 7A. A sensing circuit structure S7 is formed on the substrate70. The sensing circuit structure S7 includes a transparent conductivelayer 71, a transparent conductive connection part 715, a conductivebonding object 76, and a pin 77. Besides, the conductive bonding object76 is formed on the substrate 70 and a terminal of the transparentconductive connection part 715, to bond the pin 77 to the substrate 70and be conducted with a terminal of the transparent conductiveconnection part 715. Thereby, the pin 77 is electrically connected withthe transparent conductive layer 71 by the transparent conductiveconnection part 715, so as to transmit touch signals. The shieldinglayer F is formed on the transparent conductive layer 71 and thetransparent conductive connection part 715 to avoid a transmittancedifference between the transparent conductive layer 71 and thetransparent conductive connection part 715 to generate a visualdifference.

Additionally, please also refer to FIG. 7B. The structure in FIG. 7B issubstantially similar to the structure in FIG. 1C, except that twoconductive decorative pads 72 are provided and the conductive bondingobject 76 is formed on the substrate 70 and the terminal of thetransparent conductive connection part 715. Therefore, the conductivebonding object 76 bonds the pin 77 to the substrate 70 and is conductedwith the terminal of the transparent conductive connection part 715 toelectrically connected with the pin 77 and the transparent conductivelayer 71 by the transparent conductive connection part 715, theconductive decorative pad 72, the non-transparent conductive layer 74,and the another conductive decorative pad 72 sequentially. Theinsulation layer 75 is formed on the most upper side and has the effectof protecting the lower structure.

In the above two embodiments, the structure of the pin 77 is modifiedfrom a stacking type on the upper side of the sensing circuit structureS7 to an extensive type close to the substrate 70, so as to have theeffect of decreasing the thickness of the touch panels 7 a and 7 b.

In summary, according to the touch panel with the single plate and themanufacturing method of the present invention, the substrate is utilizedfor forming the sensing circuit structure to provide a traditional touchfunction. Moreover, a disposing location of the single plate in thetouch panel is located on the operating side and may be directly takenas the cover, such that the circuits and components covered by thesingle plate may not be exposed to the outside to have the protectiveeffect. Additionally, in the embodiment, the sensing circuit structureformed on the substrate may also have the shielding function, or theshielding structure or the shielding body may also be formed on theother substrate. Therefore, when the substrate covers the bordercircuits and other components, which are not desired to be perceived bythe user, the substrate may have the shielding effect and facilitate aplanarization of the touch panel.

The touch panel with the single plate and the multi-function of thepresent invention may be implemented by improving the structure of thesubstrate. In comparison with the prior art, the single plate providesthe completely touch function, does not require bonding the cover filmor cover lens by the bonding process, and may maintain a structuralstrength supported by the general touch panel. Thus, in addition toeliminating a requirement of utilizing another substrate to form thetouch panel, the space and manufacturing cost of bonding the cover filmor the cover lens is further saved to facilitate the thinning operationof the product, which belongs to a creative concept of forward-looking.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A touch panel with a single plate comprising: asubstrate, taken as a cover; a sensing circuit structure, formed on thesubstrate and having a shielding function; and a shielding structure,formed on the substrate.
 2. The touch panel of claim 1, wherein thesensing circuit structure comprises: a transparent conductive layer,formed on the substrate; a conductive decorative pad, formed on thetransparent conductive layer; a decorative layer, formed on thetransparent conductive layer and the conductive decorative pad, andhaving an opening on the conductive decorative pad; and anon-transparent conductive layer, formed on the decorative layer, andelectrically connected with the transparent conductive layer via theopening.
 3. The touch panel of claim 2, wherein the conductivedecorative pad completely covers the opening, a conductive capacity ofthe conductive decorative pad is superior to a conductive capacity ofthe decorative layer, and a color of the conductive decorative pad issubstantially the same with a color of the decorative layer.
 4. Thetouch panel of claim 2, wherein a material of the conductive decorativepad comprises carbon, nano copper, nano silver, or conductive polymerresin, and a material of the decorative layer comprises various colorinks with insulation.
 5. The touch panel of claim 2, wherein a part ofthe non-transparent conductive layer is formed on the opening, and amaterial of the non-transparent conductive layer comprises a metalmaterial or a radiation-curable conductive material.
 6. The touch panelof claim 5, wherein the non-transparent conductive layer is formed byutilizing a radiation to irradiate the radiation-curable conductivematerial for curing a part of the radiation-curable conductive materialand removing an incurable radiation-curable conductive material.
 7. Thetouch panel of claim 6, wherein a curable part of the radiation-curableconductive material is made by setting a mask on the radiation-curableconductive material to selectively cure the radiation-curable conductivematerial.
 8. The touch panel of claim 2, wherein the sensing circuitstructure further comprises: a conductive filler, formed on the opening.9. The touch panel of claim 2, wherein the transparent conductive layercomprises a plurality of first transparent conductive units and aplurality of second transparent conductive units, the plurality of firsttransparent conductive units and the plurality of second transparentconductive units are formed on a same side of the substrate, and theplurality of first transparent conductive units and the plurality ofsecond transparent conductive units respectively have an extendingdirection perpendicular to each other.
 10. The touch panel of claim 9,wherein the transparent conductive layer further comprises an insulationpart formed between the plurality of first transparent conductive unitsand the plurality of second transparent conductive units.
 11. The touchpanel of claim 1, wherein the sensing circuit structure comprises: atransparent conductive layer, formed on the substrate; a shieldingdecorative layer, formed on the substrate and the transparent conductivelayer; a transparent conductive connection layer, formed on thetransparent conductive layer and the shielding decorative layer,extended from the transparent conductive layer toward the shieldingdecorative layer, and exceeding an edge of the transparent conductivelayer; and a non-transparent conductive layer, formed on the shieldingdecorative layer and the transparent conductive connection layer, andnot formed on the transparent conductive layer.
 12. The touch panel ofclaim 11, wherein the non-transparent conductive layer formed on theshielding decorative layer is extended toward the transparent conductivelayer and doest not exceed the edge of the transparent conductive layer.13. The touch panel of claim 11, wherein a material of the shieldingdecorative layer comprises various color inks with insulation, amaterial of the transparent conductive layer comprises conductivepolymer resin or indium tin oxide, and a material of the non-transparentconductive layer comprises silver glue, copper, molybdenum, or aluminum.14. The touch panel of claim 11, wherein the shielding decorative layerhas an opening on the transparent conductive layer, the transparentconductive connection layer is filled into the opening, and the sensingcircuit structure further comprise: another shielding decorative layer,formed on the transparent conductive layer to cover the opening.
 15. Thetouch panel of claim 11, wherein a material of the non-transparentconductive layer comprises a metal material or a radiation-curableconductive material.
 16. The touch panel of claim 15, wherein thenon-transparent conductive layer is formed by utilizing a radiation toirradiate the radiation-curable conductive material for curing a part ofthe radiation-curable conductive material and removing an incurableradiation-curable conductive material.
 17. The touch panel of claim 16,wherein a curable part of the radiation-curable conductive material ismade by setting a mask on the radiation-curable conductive material toselectively cure the radiation-curable conductive material.
 18. Thetouch panel of claim 11, wherein the transparent conductive layercomprises a plurality of first transparent conductive units and aplurality of second transparent conductive units, the plurality of firsttransparent conductive units and the plurality of second transparentconductive units are formed on a same side of the substrate, and theplurality of first transparent conductive units and the plurality ofsecond transparent conductive units respectively have an extendingdirection perpendicular to each other.
 19. The touch panel of claim 18,wherein the transparent conductive layer further comprises an insulationpart formed between the plurality of first transparent conductive unitsand the plurality of second transparent conductive units.
 20. The touchpanel of claim 1, wherein the sensing circuit structure comprises atransparent conductive layer and a touch sensing circuit is defined inthe transparent conductive layer.
 21. The touch panel of claim 1,wherein the sensing circuit structure further comprises: a pin; and aconductive bonding object, bonding the pin and the non-transparentconductive layer.
 22. The touch panel of claim 1, wherein the sensingcircuit structure comprises: a pin; and a conductive bonding object,formed on the substrate, bonding the pin and the substrate, andelectrically connecting the pin and the transparent conductive layer.23. A touch panel with a single plate comprising: a substrate, taken asa cover; and a sensing circuit structure, formed on the substrate andhaving a shielding function.
 24. The touch panel of claim 23, whereinthe sensing circuit structure comprises: a transparent conductive layer,formed on the substrate; a conductive decorative pad, formed on thetransparent conductive layer; a decorative layer, formed on thetransparent conductive layer and the conductive decorative pad, andhaving an opening on the conductive decorative pad; and anon-transparent conductive layer, formed on the decorative layer, andelectrically connected with the transparent conductive layer via theopening.
 25. The touch panel of claim 23, wherein the sensing circuitstructure comprises: a transparent conductive layer, formed on thesubstrate; a shielding decorative layer, formed on the substrate and thetransparent conductive layer; a transparent conductive connection layer,formed on the transparent conductive layer and the shielding decorativelayer, extended from the transparent conductive layer toward theshielding decorative layer, and exceeding an edge of the transparentconductive layer; and a non-transparent conductive layer, formed on theshielding decorative layer and the transparent conductive connectionlayer, and not formed on the transparent conductive layer.
 26. Amanufacturing method of a touch panel with a single plate, comprising:forming a sensing circuit structure having a shielding function on asubstrate; forming a shielding structure on a substrate; and taking thesubstrate as a cover.
 27. The manufacturing method of claim 26, whereinthe step of forming the sensing circuit structure comprises: forming atransparent conductive layer on the substrate; forming a conductivedecorative pad on the transparent conductive layer; forming a decorativelayer on the conductive decorative pad, wherein the decorative layer hasan opening on the conductive decorative pad; and forming anon-transparent conductive layer on the decorative layer, wherein thenon-transparent conductive layer is electrically connected with thetransparent conductive layer via the opening.
 28. The manufacturingmethod of claim 27, wherein the non-transparent conductive layer isformed by utilizing a radiation to irradiate the radiation-curableconductive material for curing a part of the radiation-curableconductive material and removing an incurable radiation-curableconductive material.
 29. The manufacturing method of claim 28, wherein acurable part of the radiation-curable conductive material is made bysetting a mask on the radiation-curable conductive material toselectively cure the radiation-curable conductive material.
 30. Themanufacturing method of claim 27, wherein the step of forming thesensing circuit structure further comprises: forming a conductivebonding object on the substrate; and bonding the pin and the substrateby the conductive bonding object, and electrically connecting the pinand the transparent conductive layer by the conductive bonding object.31. The manufacturing method of claim 26, wherein the step of formingthe sensing circuit structure comprises: forming a transparentconductive layer on the substrate; forming a shielding decorative layeron the substrate and the transparent conductive layer; forming atransparent conductive connection layer on the transparent conductivelayer and the shielding decorative layer, wherein the transparentconductive connection layer is extended from the transparent conductivelayer toward the shielding decorative layer and exceeds an edge of thetransparent conductive layer; and forming a non-transparent conductivelayer on the shielding decorative layer and the transparent conductiveconnection layer, wherein the non-transparent conductive layer is notformed on the transparent conductive layer.
 32. The manufacturing methodof claim 31, wherein the shielding decorative layer has an opening onthe transparent conductive layer, the transparent conductive connectionlayer is filled into the opening, and the step of forming the sensingcircuit structure further comprises: forming another shieldingdecorative layer on the transparent conductive layer to cover theopening.
 33. The manufacturing method of claim 31, wherein thenon-transparent conductive layer is formed by utilizing a radiation toirradiate the radiation-curable conductive material for curing a part ofthe radiation-curable conductive material and removing an incurableradiation-curable conductive material.
 34. The manufacturing method ofclaim 33, wherein a curable part of the radiation-curable conductivematerial is made by setting a mask on the radiation-curable conductivematerial to selectively cure the radiation-curable conductive material.35. The manufacturing method of claim 31, wherein the step of formingthe sensing circuit structure further comprises: forming a conductivebonding object on the substrate; and bonding the pin and the substrateby the conductive bonding object, and electrically connecting the pinand the transparent conductive layer by the conductive bonding object.